VAR-201909-1453

Vulnerability from variot - Updated: 2024-11-23 22:44

Possible buffer overflow issue due to lack of length check when parsing the extended cap IE header length in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574, QCA6574AU, QCA6584, QCA8081, QCA9379, QCS404, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, SXR1130. plural Snapdragon The product contains a classic buffer overflow vulnerability.Information is obtained, information is altered, and service operation is disrupted (DoS) There is a possibility of being put into a state. Qualcomm WLAN chip is a dedicated chip for Qualcomm platform to handle WLAN/WIFI protocol. It belongs to Qualcomm Baseband subsystem, which is used to improve WLAN/WIFI processing speed and performance and reduce energy consumption. A remote code execution vulnerability exists in the Qualcomm WLAN chip. An attacker can control the WLAN firmware and eventually cause arbitrary code to be executed on the server. Qualcomm MDM9206 and others are products of Qualcomm (Qualcomm). MDM9206 is a central processing unit (CPU) product. MDM9607 is a central processing unit (CPU) product. MDM9640 is a central processing unit (CPU) product. A buffer error vulnerability exists in several Qualcomm products. This vulnerability stems from the incorrect verification of data boundaries when the network system or product performs operations on the memory, resulting in incorrect read and write operations to other associated memory locations. Attackers can exploit this vulnerability to cause buffer overflow or heap overflow, etc. The following products and versions are affected: Qualcomm MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574, QCA6574AU, QCA6584, QCA8081, QCA9379, QCS404, QCS405, QCS605; Qualcomm 215, SD 2120/SD 2120/SD , SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX; Qualcomm SDA660, SDM439, SDM630, SDM660; Qualcomm SDX20, SDX24, SXR1130

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Sightings

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Nomenclature

  • Seen: The vulnerability was mentioned, discussed, or observed by the user.
  • Confirmed: The vulnerability has been validated from an analyst's perspective.
  • Published Proof of Concept: A public proof of concept is available for this vulnerability.
  • Exploited: The vulnerability was observed as exploited by the user who reported the sighting.
  • Patched: The vulnerability was observed as successfully patched by the user who reported the sighting.
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  • Not confirmed: The user expressed doubt about the validity of the vulnerability.
  • Not patched: The vulnerability was not observed as successfully patched by the user who reported the sighting.


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