FKIE_CVE-2017-18314

Vulnerability from fkie_nvd - Published: 2018-09-20 13:29 - Updated: 2026-06-17 01:12
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
Impacted products
Vendor Product Version
qualcomm mdm9206_firmware -
qualcomm mdm9206 -
qualcomm mdm9607_firmware -
qualcomm mdm9607 -
qualcomm mdm9635m_firmware -
qualcomm mdm9635m -
qualcomm mdm9640_firmware -
qualcomm mdm9640 -
qualcomm mdm9645_firmware -
qualcomm mdm9645 -
qualcomm mdm9650_firmware -
qualcomm mdm9650 -
qualcomm mdm9655_firmware -
qualcomm mdm9655 -
qualcomm msm8909w_firmware -
qualcomm msm8909w -
qualcomm msm8996au_firmware -
qualcomm msm8996au -
qualcomm sd210_firmware -
qualcomm sd210 -
qualcomm sd212_firmware -
qualcomm sd212 -
qualcomm sd205_firmware -
qualcomm sd205 -
qualcomm sd410_firmware -
qualcomm sd410 -
qualcomm sd412_firmware -
qualcomm sd412 -
qualcomm sd425_firmware -
qualcomm sd425 -
qualcomm sd427_firmware -
qualcomm sd427 -
qualcomm sd430_firmware -
qualcomm sd430 -
qualcomm sd435_firmware -
qualcomm sd435 -
qualcomm sd450_firmware -
qualcomm sd450 -
qualcomm sd615_firmware -
qualcomm sd615 -
qualcomm sd616_firmware -
qualcomm sd616 -
qualcomm sd415_firmware -
qualcomm sd415 -
qualcomm sd617_firmware -
qualcomm sd617 -
qualcomm sd625_firmware -
qualcomm sd625 -
qualcomm sd650_firmware -
qualcomm sd650 -
qualcomm sd652_firmware -
qualcomm sd652 -
qualcomm sd810_firmware -
qualcomm sd810 -
qualcomm sd820_firmware -
qualcomm sd820 -
qualcomm sd820a_firmware -
qualcomm sd820a -
qualcomm sd835_firmware -
qualcomm sd835 -
qualcomm sda660_firmware -
qualcomm sda660 -
qualcomm sdm429_firmware -
qualcomm sdm429 -
qualcomm sdm439_firmware -
qualcomm sdm439 -
qualcomm sdm630_firmware -
qualcomm sdm630 -
qualcomm sdm632_firmware -
qualcomm sdm632 -
qualcomm sdm636_firmware -
qualcomm sdm636 -
qualcomm sdm660_firmware -
qualcomm sdm660 -

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  "cveTags": [],
  "descriptions": [
    {
      "lang": "en",
      "value": "In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ."
    },
    {
      "lang": "es",
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  "id": "CVE-2017-18314",
  "lastModified": "2026-06-17T01:12:36.630",
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        "acInsufInfo": false,
        "baseSeverity": "HIGH",
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          "accessVector": "NETWORK",
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          "baseScore": 10.0,
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          "vectorString": "AV:N/AC:L/Au:N/C:C/I:C/A:C",
          "version": "2.0"
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        "exploitabilityScore": 10.0,
        "impactScore": 10.0,
        "obtainAllPrivilege": false,
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          "baseScore": 9.8,
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          "privilegesRequired": "NONE",
          "scope": "UNCHANGED",
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          "vectorString": "CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
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  "published": "2018-09-20T13:29:00.667",
  "references": [
    {
      "source": "product-security@qualcomm.com",
      "tags": [
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      "url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
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  "vulnStatus": "Modified",
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}



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