CVE-2017-18156 (GCVE-0-2017-18156)
Vulnerability from cvelistv5 – Published: 2019-05-06 22:28 – Updated: 2024-08-05 21:13
VLAI
EPSS
VEX
Summary
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
Severity
7.8 (High)
CWE
- CWE416: Use After Free
Assigner
References
1 reference
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security… | x_refsource_MISC |
Impacted products
1 product
| Vendor | Product | Version | CPE status | |
|---|---|---|---|---|
| Qualcomm Technologies, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206
Affected: MDM9607 Affected: MDM9650 Affected: MSM8996AU Affected: SD 210/SD 212/SD 205 Affected: SD 625 Affected: SD 820 Affected: SD 820A Affected: SD 835 Affected: SDX20 |
guessed |
Date Public
2019-03-25 00:00
{
"containers": {
"adp": [
{
"providerMetadata": {
"dateUpdated": "2024-08-05T21:13:48.897Z",
"orgId": "af854a3a-2127-422b-91ae-364da2661108",
"shortName": "CVE"
},
"references": [
{
"tags": [
"x_refsource_MISC",
"x_transferred"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
],
"title": "CVE Program Container"
}
],
"cna": {
"affected": [
{
"product": "Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear",
"vendor": "Qualcomm Technologies, Inc.",
"versions": [
{
"status": "affected",
"version": "MDM9206"
},
{
"status": "affected",
"version": "MDM9607"
},
{
"status": "affected",
"version": "MDM9650"
},
{
"status": "affected",
"version": "MSM8996AU"
},
{
"status": "affected",
"version": "SD 210/SD 212/SD 205"
},
{
"status": "affected",
"version": "SD 625"
},
{
"status": "affected",
"version": "SD 820"
},
{
"status": "affected",
"version": "SD 820A"
},
{
"status": "affected",
"version": "SD 835"
},
{
"status": "affected",
"version": "SDX20"
}
]
}
],
"datePublic": "2019-03-25T00:00:00.000Z",
"descriptions": [
{
"lang": "en",
"value": "While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20."
}
],
"problemTypes": [
{
"descriptions": [
{
"description": "CWE416: Use After Free",
"lang": "en",
"type": "text"
}
]
}
],
"providerMetadata": {
"dateUpdated": "2019-05-06T22:28:03.000Z",
"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"shortName": "qualcomm"
},
"references": [
{
"tags": [
"x_refsource_MISC"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
],
"x_legacyV4Record": {
"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"ID": "CVE-2017-18156",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
{
"product": {
"product_data": [
{
"product_name": "Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear",
"version": {
"version_data": [
{
"version_value": "MDM9206"
},
{
"version_value": "MDM9607"
},
{
"version_value": "MDM9650"
},
{
"version_value": "MSM8996AU"
},
{
"version_value": "SD 210/SD 212/SD 205"
},
{
"version_value": "SD 625"
},
{
"version_value": "SD 820"
},
{
"version_value": "SD 820A"
},
{
"version_value": "SD 835"
},
{
"version_value": "SDX20"
}
]
}
}
]
},
"vendor_name": "Qualcomm Technologies, Inc."
}
]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20."
}
]
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "CWE416: Use After Free"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://www.qualcomm.com/company/product-security/bulletins",
"refsource": "MISC",
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
]
}
}
}
},
"cveMetadata": {
"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"assignerShortName": "qualcomm",
"cveId": "CVE-2017-18156",
"datePublished": "2019-05-06T22:28:03.000Z",
"dateReserved": "2018-02-05T00:00:00.000Z",
"dateUpdated": "2024-08-05T21:13:48.897Z",
"state": "PUBLISHED"
},
"dataType": "CVE_RECORD",
"dataVersion": "5.1",
"vulnerability-lookup:meta": {
"epss": {
"cve": "CVE-2017-18156",
"date": "2026-10-01",
"epss": "0.00245",
"percentile": "0.14241"
},
"nvd": {
"cve": {
"configurations": [
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "A960B86A-C397-4ACB-AEE6-55F316D32949",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*",
"matchCriteriaId": "D79B8959-3D1E-4B48-9181-D75FE90AAF98",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "A35FECFB-60AE-42A8-BCBB-FEA7D5826D49",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E9765187-8653-4D66-B230-B2CE862AC5C0",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "35B7E25E-FA92-4C36-883C-CFF36F4B3507",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*",
"matchCriteriaId": "ECD99C6F-2444-4A5E-A517-0C8023DDF23D",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "8CA1E7B0-782B-4757-B118-802943798984",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*",
"matchCriteriaId": "95CB08EC-AE12-4A54-AA3C-998F01FC8763",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "0FA80D57-3191-47CF-AD3F-9F2D64E443FE",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*",
"matchCriteriaId": "B2AFB212-F01A-4CEB-8DB4-2E0CC2308CB6",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E0986EF1-0974-488E-84C4-6880F876CE55",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*",
"matchCriteriaId": "8C08BA58-2EBC-4A22-85A4-2ECD54693B9B",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "27110478-4C08-49E6-BD53-8BAAD9D5BD65",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*",
"matchCriteriaId": "3664D302-D22A-4B25-B534-3097AE2F8573",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "06E0CC35-AC20-42D7-8FEA-CA4685E33E72",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*",
"matchCriteriaId": "4A2C4DED-2367-4736-A0AF-C8356F1271AD",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E077FC03-F86F-417A-A3E6-BC88CB85C6F0",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E016356C-94ED-4CDD-8351-97D265FE036E",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "E08016A2-E4FE-4E9C-A915-C66BE157AFB5",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*",
"matchCriteriaId": "018452D0-007C-4740-B2AF-E5C8BBAC310F",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "1CFF35A3-1472-4665-9DAB-1ABC45C0D5B4",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*",
"matchCriteriaId": "F930E9BF-C502-49C6-8BE8-9A711B89FA1B",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
},
{
"nodes": [
{
"cpeMatch": [
{
"criteria": "cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*",
"matchCriteriaId": "A0CE1B23-6FE3-41C4-B264-C7A9E8BDBEC1",
"vulnerable": true
}
],
"negate": false,
"operator": "OR"
},
{
"cpeMatch": [
{
"criteria": "cpe:2.3:h:qualcomm:sdx20:-:*:*:*:*:*:*:*",
"matchCriteriaId": "794BA13C-3C63-4695-AA45-676F85D904BE",
"vulnerable": false
}
],
"negate": false,
"operator": "OR"
}
],
"operator": "AND"
}
],
"cveTags": [],
"descriptions": [
{
"lang": "en",
"value": "While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20."
},
{
"lang": "es",
"value": "Durante el procesamiento de los b\u00faferes de la c\u00e1mara en el controlador de la c\u00e1mara, se puede producir una condici\u00f3n de referencia a memoria despu\u00e9s de que haya sido liberada en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20."
}
],
"id": "CVE-2017-18156",
"lastModified": "2024-11-21T03:19:27.807",
"metrics": {
"cvssMetricV2": [
{
"acInsufInfo": false,
"baseSeverity": "HIGH",
"cvssData": {
"accessComplexity": "LOW",
"accessVector": "LOCAL",
"authentication": "NONE",
"availabilityImpact": "COMPLETE",
"baseScore": 7.2,
"confidentialityImpact": "COMPLETE",
"integrityImpact": "COMPLETE",
"vectorString": "AV:L/AC:L/Au:N/C:C/I:C/A:C",
"version": "2.0"
},
"exploitabilityScore": 3.9,
"impactScore": 10.0,
"obtainAllPrivilege": false,
"obtainOtherPrivilege": false,
"obtainUserPrivilege": false,
"source": "nvd@nist.gov",
"type": "Primary",
"userInteractionRequired": false
}
],
"cvssMetricV30": [
{
"cvssData": {
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.0"
},
"exploitabilityScore": 1.8,
"impactScore": 5.9,
"source": "nvd@nist.gov",
"type": "Primary"
}
]
},
"published": "2019-05-06T23:29:00.360",
"references": [
{
"source": "product-security@qualcomm.com",
"tags": [
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
},
{
"source": "af854a3a-2127-422b-91ae-364da2661108",
"tags": [
"Vendor Advisory"
],
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
],
"sourceIdentifier": "product-security@qualcomm.com",
"vulnStatus": "Modified",
"weaknesses": [
{
"description": [
{
"lang": "en",
"value": "CWE-416"
}
],
"source": "nvd@nist.gov",
"type": "Primary"
}
]
}
}
}
}
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Experimental. This forecast is provided for visualization only and may change without notice. Do not use it for operational decisions.
Forecast uses a logistic model when the trend is rising, or an exponential decay model when the trend is falling. Fitted via linearized least squares.
Sightings
| Author | Source | Type | Date | Other |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or observed by the user.
- Confirmed: The vulnerability has been validated from an analyst's perspective.
- Published Proof of Concept: A public proof of concept is available for this vulnerability.
- Exploited: The vulnerability was observed as exploited by the user who reported the sighting.
- Patched: The vulnerability was observed as successfully patched by the user who reported the sighting.
- Not exploited: The vulnerability was not observed as exploited by the user who reported the sighting.
- Not confirmed: The user expressed doubt about the validity of the vulnerability.
- Not patched: The vulnerability was not observed as successfully patched by the user who reported the sighting.
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The MITRE ATT&CK techniques below are AI-generated suggestions, inferred from the description of the
vulnerability by the CIRCL/vulnerability-attack-technique-classification-roberta-base
model, served locally by ML-Gateway.
They have not been verified by an analyst and are provided for guidance only.
The approach is described in our paper Mapping CVEs to MITRE ATT&CK Techniques: A Curated Gold-Set Classifier and the Limits of LLM-Assisted Label Expansion.
Browse all ATT&CK techniques and the vulnerabilities related to each.
The approach is described in our paper Mapping CVEs to MITRE ATT&CK Techniques: A Curated Gold-Set Classifier and the Limits of LLM-Assisted Label Expansion.
Browse all ATT&CK techniques and the vulnerabilities related to each.
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Related by attack behaviour
Vulnerabilities whose description is nearest to this one in the vector space of the CIRCL/vulnerability-attack-technique-biencoder model. This is a similarity search over the bi-encoder space (plain cosine), not a classification, and it has no measured accuracy.
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