CVE-2024-43047 (GCVE-0-2024-43047)
Vulnerability from cvelistv5 – Published: 2024-10-07 12:59 – Updated: 2025-10-21 22:55Title
Use After Free in DSP Service
Summary
Memory corruption while maintaining memory maps of HLOS memory.
Severity
7.8 (High)
SSVC
Exploitation: active
Automatable: no
Technical Impact: total
CISA Coordinator · CISA-ADP (v2.0.3)
Decision recorded 2024-10-09 12:56 UTC
CWE
- CWE-416 - Use After Free
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://docs.qualcomm.com/product/publicresources… | |
| https://www.cisa.gov/known-exploited-vulnerabilit… | government-resource |
Impacted products
65 products
| Vendor | Product | Version | CPE status | |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon |
Affected:
FastConnect 6700
Affected: FastConnect 6800 Affected: FastConnect 6900 Affected: FastConnect 7800 Affected: QAM8295P Affected: QCA6174A Affected: QCA6391 Affected: QCA6426 Affected: QCA6436 Affected: QCA6574AU Affected: QCA6584AU Affected: QCA6595 Affected: QCA6595AU Affected: QCA6688AQ Affected: QCA6696 Affected: QCA6698AQ Affected: QCS410 Affected: QCS610 Affected: QCS6490 Affected: Qualcomm Video Collaboration VC1 Platform Affected: Qualcomm Video Collaboration VC3 Platform Affected: SA4150P Affected: SA4155P Affected: SA6145P Affected: SA6150P Affected: SA6155P Affected: SA8145P Affected: SA8150P Affected: SA8155P Affected: SA8195P Affected: SA8295P Affected: SD660 Affected: SD865 5G Affected: SG4150P Affected: Snapdragon 660 Mobile Platform Affected: Snapdragon 680 4G Mobile Platform Affected: Snapdragon 685 4G Mobile Platform (SM6225-AD) Affected: Snapdragon 8 Gen 1 Mobile Platform Affected: Snapdragon 865 5G Mobile Platform Affected: Snapdragon 865+ 5G Mobile Platform (SM8250-AB) Affected: Snapdragon 870 5G Mobile Platform (SM8250-AC) Affected: Snapdragon 888 5G Mobile Platform Affected: Snapdragon 888+ 5G Mobile Platform (SM8350-AC) Affected: Snapdragon Auto 5G Modem-RF Affected: Snapdragon Auto 5G Modem-RF Gen 2 Affected: Snapdragon X55 5G Modem-RF System Affected: Snapdragon XR2 5G Platform Affected: SW5100 Affected: SW5100P Affected: SXR2130 Affected: WCD9335 Affected: WCD9341 Affected: WCD9370 Affected: WCD9375 Affected: WCD9380 Affected: WCD9385 Affected: WCN3950 Affected: WCN3980 Affected: WCN3988 Affected: WCN3990 Affected: WSA8810 Affected: WSA8815 Affected: WSA8830 Affected: WSA8835 |
guessed | |
| qualcomm | fastconnect_6700_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | fastconnect_6800_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | fastconnect_6900_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | fastconnect_7800_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qam8295p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6174a_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6391_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6426_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6436_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6574au_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6584au_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6595_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6595au_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6688aq_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6688aq_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6696_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qca6698aq_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qcs410_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qcs610_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qcs6490_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qualcomm_video_collaboration_vc1_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qualcomm_video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | qualcomm_video_collaboration_vc3_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:qualcomm_video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa4150p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa4155p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa6145p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa6150p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa6155p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa8145p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa8150p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa8155p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa8195p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sa8295p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sd660_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sd865_5g_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sg4150p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_660_mobile_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_660_mobile_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_680_4g_mobile_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_8_gen_1_mobile_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_865_5g_mobile_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_888_5g_mobile_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_888_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_auto_5g_modem-rf_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_auto_5g_modem-rf_gen_2_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_gen_2_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_x55_5g_modem-rf_system_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_xr2_5g_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sw5100_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sw5100p_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sxr2130_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcd9335_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcd9341_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcd9370_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcd9375_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcd9380_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcd9385_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcn3950_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcn3980_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcn3988_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wcn3990_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wcn3990_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wsa8810_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wsa8815_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wsa8830_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | wsa8835_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_865\+_5g_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_865\+_5g_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_870_5g_mobile_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | snapdragon_888\+_5g_mobile_platform_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:snapdragon_888\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* |
||
| qualcomm | sm6225-ad_firmware |
Affected:
0 , ≤ *
(custom)
cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:* |
CISA
Known Exploited Vulnerability - GCVE BCP-07 Compliant
KEV entry ID: 405a0911-6dd1-45d5-b3cd-9db428608605
Exploited: Yes
Timestamps
First Seen: 2024-10-08
Asserted: 2024-10-08
Scope
Notes: KEV entry: Qualcomm Multiple Chipsets Use-After-Free Vulnerability | Affected: Qualcomm / Multiple Chipsets | Description: Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory. | Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. | Due date: 2024-10-29 | Known ransomware campaign use (KEV): Unknown | Notes (KEV): https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047
Evidence
Type: Vendor Report
Signal: Successful Exploitation
Confidence: 80%
Source: cisa-kev
Details
| Cwes | CWE-416 |
|---|---|
| Feed | CISA Known Exploited Vulnerabilities Catalog |
| Product | Multiple Chipsets |
| Due Date | 2024-10-29 |
| Date Added | 2024-10-08 |
| Vendorproject | Qualcomm |
| Vulnerabilityname | Qualcomm Multiple Chipsets Use-After-Free Vulnerability |
| Knownransomwarecampaignuse | Unknown |
References
Created: 2026-02-02 13:24 UTC
| Updated: 2026-02-06 07:53 UTC
Previdian
Known Exploited Vulnerability - GCVE BCP-07 Compliant
KEV entry ID: 541a54a0-ce59-4ff6-bfb5-c14570548942
Exploited: Yes
Timestamps
First Seen: 2024-10-08
Asserted: 2024-10-08
Scope
Notes: KEVIntel entry: Use After Free in DSP Service | Affected: Qualcomm, Inc. / Snapdragon | CVSS: 7.8 (HIGH) | Used in malware: unknown | Not yet in CISA KEV: False
Evidence
Type: Public Report
Signal: Successful Exploitation
Confidence: 70%
Source: kevintel
Details
| Feed | KEVIntel (kevintel.com) |
|---|---|
| Title | Use After Free in DSP Service |
| Vendor | Qualcomm, Inc. |
| Product | Snapdragon |
| Added Date | 2024-10-08T00:00:00.000Z |
| Cvss Score | 7.8 |
| Epss Score | None |
| Cvss Severity | HIGH |
| Epss Percentile | None |
| Used In Malware | unknown |
| Ahead Of Cisa Kev | None |
| Not Yet In Cisa Kev | False |
References
Created: 2026-06-23 11:14 UTC
| Updated: 2026-06-23 11:14 UTC
{
"containers": {
"adp": [
{
"affected": [
{
"cpes": [
"cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*"
],
"defaultStatus": "unknown",
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{
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},
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],
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},
{
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{
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],
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{
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],
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]
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{
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],
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{
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},
{
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],
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{
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},
{
"cpes": [
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],
"defaultStatus": "unknown",
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"vendor": "qualcomm",
"versions": [
{
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"status": "affected",
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}
]
},
{
"cpes": [
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],
"defaultStatus": "unknown",
"product": "qca6436_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
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}
]
},
{
"cpes": [
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],
"defaultStatus": "unknown",
"product": "qca6574au_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
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}
]
},
{
"cpes": [
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],
"defaultStatus": "unknown",
"product": "qca6584au_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
"version": "0",
"versionType": "custom"
}
]
},
{
"cpes": [
"cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*"
],
"defaultStatus": "unknown",
"product": "qca6595_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
"version": "0",
"versionType": "custom"
}
]
},
{
"cpes": [
"cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*"
],
"defaultStatus": "unknown",
"product": "qca6595au_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
"version": "0",
"versionType": "custom"
}
]
},
{
"cpes": [
"cpe:2.3:o:qualcomm:qca6688aq_firmware:-:*:*:*:*:*:*:*"
],
"defaultStatus": "unknown",
"product": "qca6688aq_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
"version": "0",
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}
]
},
{
"cpes": [
"cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*"
],
"defaultStatus": "unknown",
"product": "qca6696_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
"version": "0",
"versionType": "custom"
}
]
},
{
"cpes": [
"cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*"
],
"defaultStatus": "unknown",
"product": "qca6698aq_firmware",
"vendor": "qualcomm",
"versions": [
{
"lessThanOrEqual": "*",
"status": "affected",
"version": "0",
"versionType": "custom"
}
]
},
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{
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{
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{
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"value": "Memory corruption while maintaining memory maps of HLOS memory."
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],
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{
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"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
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}
]
}
],
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"description": "CWE-416 Use After Free",
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}
]
}
],
"providerMetadata": {
"dateUpdated": "2024-10-07T12:59:01.656Z",
"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"shortName": "qualcomm"
},
"references": [
{
"url": "https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html"
}
],
"title": "Use After Free in DSP Service"
}
},
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"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"assignerShortName": "qualcomm",
"cveId": "CVE-2024-43047",
"datePublished": "2024-10-07T12:59:01.656Z",
"dateReserved": "2024-08-05T14:22:16.918Z",
"dateUpdated": "2025-10-21T22:55:43.826Z",
"state": "PUBLISHED"
},
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"dataVersion": "5.1",
"vulnerability-lookup:meta": {
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"cveID": "CVE-2024-43047",
"cwes": [
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],
"dateAdded": "2024-10-08",
"dueDate": "2024-10-29",
"forensicTriage": "No",
"knownRansomwareCampaignUse": "Unknown",
"notes": "https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047",
"product": "Multiple Chipsets ",
"requiredAction": "Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.",
"shortDescription": "Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory. ",
"vendorProject": "Qualcomm",
"vulnerabilityName": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability"
},
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"date": "2026-09-20",
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{
"lang": "en",
"value": "Memory corruption while maintaining memory maps of HLOS memory."
}
],
"metrics": [
{
"cvssV3_1": {
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "LOW",
"scope": "UNCHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
},
"format": "CVSS",
"scenarios": [
{
"lang": "en",
"value": "GENERAL"
}
]
}
],
"problemTypes": [
{
"descriptions": [
{
"cweId": "CWE-416",
"description": "CWE-416 Use After Free",
"lang": "en",
"type": "CWE"
}
]
}
],
"providerMetadata": {
"dateUpdated": "2024-10-07T12:59:01.656Z",
"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"shortName": "qualcomm"
},
"references": [
{
"url": "https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html"
}
],
"title": "Use After Free in DSP Service"
}
},
"cveMetadata": {
"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
"assignerShortName": "qualcomm",
"cveId": "CVE-2024-43047",
"datePublished": "2024-10-07T12:59:01.656Z",
"dateReserved": "2024-08-05T14:22:16.918Z",
"dateUpdated": "2025-10-21T22:55:43.826Z",
"state": "PUBLISHED"
},
"dataType": "CVE_RECORD",
"dataVersion": "5.1"
}
}
}
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Experimental. This forecast is provided for visualization only and may change without notice. Do not use it for operational decisions.
Forecast uses a logistic model when the trend is rising, or an exponential decay model when the trend is falling. Fitted via linearized least squares.
Sightings
| Author | Source | Type | Date | Other |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or observed by the user.
- Confirmed: The vulnerability has been validated from an analyst's perspective.
- Published Proof of Concept: A public proof of concept is available for this vulnerability.
- Exploited: The vulnerability was observed as exploited by the user who reported the sighting.
- Patched: The vulnerability was observed as successfully patched by the user who reported the sighting.
- Not exploited: The vulnerability was not observed as exploited by the user who reported the sighting.
- Not confirmed: The user expressed doubt about the validity of the vulnerability.
- Not patched: The vulnerability was not observed as successfully patched by the user who reported the sighting.
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The MITRE ATT&CK techniques below are AI-generated suggestions, inferred from the description of the
vulnerability by the CIRCL/vulnerability-attack-technique-classification-roberta-base
model, served locally by ML-Gateway.
They have not been verified by an analyst and are provided for guidance only.
The approach is described in our paper Mapping CVEs to MITRE ATT&CK Techniques: A Curated Gold-Set Classifier and the Limits of LLM-Assisted Label Expansion.
Browse all ATT&CK techniques and the vulnerabilities related to each.
The approach is described in our paper Mapping CVEs to MITRE ATT&CK Techniques: A Curated Gold-Set Classifier and the Limits of LLM-Assisted Label Expansion.
Browse all ATT&CK techniques and the vulnerabilities related to each.
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Related by attack behaviour
Vulnerabilities whose description is nearest to this one in the vector space of the CIRCL/vulnerability-attack-technique-biencoder model. This is a similarity search over the bi-encoder space (plain cosine), not a classification, and it has no measured accuracy.
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