Search

Find a vulnerability

Search criteria

    2 vulnerabilities found for zz_qcs605_firmware by qualcomm

    CVE-2018-13888 (GCVE-0-2018-13888)

    Vulnerability from nvd – Published: 2019-02-11 15:00 – Updated: 2024-08-05 09:14
    VLAI
    Summary
    There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
    Severity
    No CVSS data available.
    CWE
    • Buffer Copy Without Checking Size of Input in RIL
    Assigner
    References
    Impacted products
    Vendor Product Version
    Qualcomm, Inc. Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Affected: MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605
    		Create a notification for this product.
    Date Public
    2019-02-11 00:00
    Show details on NVD website
    To clipboard 

    {
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-05T09:14:47.275Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "name": "106475",
            "tags": [
              "vdb-entry",
              "x_refsource_BID",
              "x_transferred"
            ],
            "url": "http://www.securityfocus.com/bid/106475"
          },
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605"
            }
          ]
        }
      ],
      "datePublic": "2019-02-11T00:00:00.000Z",
      "descriptions": [
        {
          "lang": "en",
          "value": "There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605."
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Buffer Copy Without Checking Size of Input in RIL",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2019-02-12T10:57:01.000Z",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "name": "106475",
          "tags": [
            "vdb-entry",
            "x_refsource_BID"
          ],
          "url": "http://www.securityfocus.com/bid/106475"
        },
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2018-13888",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605."
            }
          ]
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Buffer Copy Without Checking Size of Input in RIL"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "106475",
              "refsource": "BID",
              "url": "http://www.securityfocus.com/bid/106475"
            },
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2018-13888",
    "datePublished": "2019-02-11T15:00:00.000Z",
    "dateReserved": "2018-07-11T00:00:00.000Z",
    "dateUpdated": "2024-08-05T09:14:47.275Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}

    CVE-2018-13888 (GCVE-0-2018-13888)

    Vulnerability from cvelistv5 – Published: 2019-02-11 15:00 – Updated: 2024-08-05 09:14
    VLAI
    Summary
    There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
    Severity
    No CVSS data available.
    CWE
    • Buffer Copy Without Checking Size of Input in RIL
    Assigner
    References
    Impacted products
    Vendor Product Version
    Qualcomm, Inc. Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Affected: MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605
    		Create a notification for this product.
    Date Public
    2019-02-11 00:00
    Show details on NVD website
    To clipboard 

    {
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-05T09:14:47.275Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "name": "106475",
            "tags": [
              "vdb-entry",
              "x_refsource_BID",
              "x_transferred"
            ],
            "url": "http://www.securityfocus.com/bid/106475"
          },
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605"
            }
          ]
        }
      ],
      "datePublic": "2019-02-11T00:00:00.000Z",
      "descriptions": [
        {
          "lang": "en",
          "value": "There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605."
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Buffer Copy Without Checking Size of Input in RIL",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2019-02-12T10:57:01.000Z",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "name": "106475",
          "tags": [
            "vdb-entry",
            "x_refsource_BID"
          ],
          "url": "http://www.securityfocus.com/bid/106475"
        },
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2018-13888",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605."
            }
          ]
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Buffer Copy Without Checking Size of Input in RIL"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "106475",
              "refsource": "BID",
              "url": "http://www.securityfocus.com/bid/106475"
            },
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2018-13888",
    "datePublished": "2019-02-11T15:00:00.000Z",
    "dateReserved": "2018-07-11T00:00:00.000Z",
    "dateUpdated": "2024-08-05T09:14:47.275Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}