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14 vulnerabilities found for sd615_firmware by qualcomm
CVE-2018-5871 (GCVE-0-2018-5871)
Vulnerability from nvd – Published: 2018-09-20 13:00 – Updated: 2024-08-05 05:47
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
Severity
No CVSS data available.
CWE
- Cryptographic Issues in WLAN
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11982 (GCVE-0-2018-11982)
Vulnerability from nvd – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:24
VLAI
EPSS
VEX
Summary
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
Severity
No CVSS data available.
CWE
- Double Free in LTE
Assigner
References
1 reference
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11292 (GCVE-0-2018-11292)
Vulnerability from nvd – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
Severity
No CVSS data available.
CWE
- Buffer Overflow in WLAN
Assigner
References
3 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
| http://support.blackberry.com/kb/articleDetail?la… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11285 (GCVE-0-2018-11285)
Vulnerability from nvd – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur.
Severity
No CVSS data available.
CWE
- Buffer over-read in Video
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11277 (GCVE-0-2018-11277)
Vulnerability from nvd – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Severity
No CVSS data available.
CWE
- Permission Issues in Telephony
Assigner
References
1 reference
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660
|
Date Public
2018-09-04 00:00
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CVE-2018-11267 (GCVE-0-2018-11267)
Vulnerability from nvd – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
Severity
No CVSS data available.
CWE
- Improper Validation of Array Index in Core
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
| http://www.securityfocus.com/bid/106128 | vdb-entryx_refsource_BID |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2017-18314 (GCVE-0-2017-18314)
Vulnerability from nvd – Published: 2018-09-20 13:00 – Updated: 2024-08-05 21:20
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
Severity
No CVSS data available.
CWE
- Improper Access Control in Core
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-5871 (GCVE-0-2018-5871)
Vulnerability from cvelistv5 – Published: 2018-09-20 13:00 – Updated: 2024-08-05 05:47
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
Severity
No CVSS data available.
CWE
- Cryptographic Issues in WLAN
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11982 (GCVE-0-2018-11982)
Vulnerability from cvelistv5 – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:24
VLAI
EPSS
VEX
Summary
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
Severity
No CVSS data available.
CWE
- Double Free in LTE
Assigner
References
1 reference
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2017-18314 (GCVE-0-2017-18314)
Vulnerability from cvelistv5 – Published: 2018-09-20 13:00 – Updated: 2024-08-05 21:20
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
Severity
No CVSS data available.
CWE
- Improper Access Control in Core
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11267 (GCVE-0-2018-11267)
Vulnerability from cvelistv5 – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
Severity
No CVSS data available.
CWE
- Improper Validation of Array Index in Core
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
| http://www.securityfocus.com/bid/106128 | vdb-entryx_refsource_BID |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11277 (GCVE-0-2018-11277)
Vulnerability from cvelistv5 – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Severity
No CVSS data available.
CWE
- Permission Issues in Telephony
Assigner
References
1 reference
| URL | Tags |
|---|---|
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660
|
Date Public
2018-09-04 00:00
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CVE-2018-11292 (GCVE-0-2018-11292)
Vulnerability from cvelistv5 – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
Severity
No CVSS data available.
CWE
- Buffer Overflow in WLAN
Assigner
References
3 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
| http://support.blackberry.com/kb/articleDetail?la… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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CVE-2018-11285 (GCVE-0-2018-11285)
Vulnerability from cvelistv5 – Published: 2018-09-20 13:00 – Updated: 2024-08-05 08:01
VLAI
EPSS
VEX
Summary
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur.
Severity
No CVSS data available.
CWE
- Buffer over-read in Video
Assigner
References
2 references
| URL | Tags |
|---|---|
| https://source.android.com/security/bulletin/2018… | x_refsource_CONFIRM |
| https://www.qualcomm.com/company/product-security… | x_refsource_CONFIRM |
Impacted products
1 product
| Vendor | Product | Version | |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear |
Affected:
MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016
|
Date Public
2018-09-04 00:00
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