{"vulnerability": "CVE-2022-25677", "sightings": [{"uuid": "f0eeb70c-644d-4548-9d9a-7be69f49e860", "vulnerability_lookup_origin": "1a89b78e-f703-45f3-bb86-59eb712668bd", "author": "2a075640-a300-48a4-bb44-bc6130783b9b", "vulnerability": "CVE-2022-25677", "type": "seen", "source": "https://t.me/DarkWebInformer_CVEAlerts/12894", "content": "\ud83d\udd17 DarkWebInformer.com - Cyber Threat Intelligence\n\ud83d\udccc CVE ID: CVE-2022-25677\n\ud83d\udd25 CVSS Score: 6.7 (cvssV3_1, Vector: CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H)\n\ud83d\udd39 Description: Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking\n\ud83d\udccf Published: 2022-12-13T00:00:00.000Z\n\ud83d\udccf Modified: 2025-04-22T15:57:50.369Z\n\ud83d\udd17 References:\n1. https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin", "creation_timestamp": "2025-04-22T16:03:40.000000Z"}]}